• 0
    • ارسال درخواست
    • حذف همه
    • Industrial Standards
    • Defence Standards
  • درباره ما
  • درخواست موردی
  • فهرست استانداردها
    • Industrial Standards
    • Defence Standards
  • راهنما
  • Login
  • لیست خرید شما 0
    • ارسال درخواست
    • حذف همه
View Item 
  •   YSE
  • Industrial Standards
  • IEEE - The Institute of Electrical and Electronics Engineers, Inc.
  • View Item
  •   YSE
  • Industrial Standards
  • IEEE - The Institute of Electrical and Electronics Engineers, Inc.
  • View Item
  • All Fields
  • Title(or Doc Num)
  • Organization
  • Year
  • Subject
Advanced Search
JavaScript is disabled for your browser. Some features of this site may not work without it.

Archive

IEEE 1149.8.1

Boundary-Scan-Based Stimulus of Interconnections to Passive and/or Active Components - IEEE Computer Society

Organization:
IEEE - The Institute of Electrical and Electronics Engineers, Inc.
Year: 2012

Abstract: This standard specifies extensions to IEEE Std 1149.1™ that define the boundary-scan structures and methods required to facilitate boundary-scan-based stimulus of interconnections to passive and/or active components.1 Such networks are not adequately addressed by existing standards, including those networks that are ac-coupled or differential. The selective ac stimulus generation enabled by this standard, when combined with non-contact signal sensing, will allow testing of the connections between devices adhering to this standard and circuit elements such as series components, sockets, connectors, and integrated circuits (ICs) that do not implement IEEE Std 1149.1. This standard also specifies Boundary-Scan Description Language (BSDL) extensions to IEEE Std 1149.1 required to describe and support the new structures and methods.
Purpose
The purpose of this standard is to codify testability circuitry added to an IC incremental to the testability provisions specified by IEEE Std 1149.1. This will enable selective ac stimulus generation that, when combined with non-contact signal sensing, allows testing signal paths between devices adhering to this standard and passive and/or active components.
1Information on references can be found in Clause 2.
URI: https://yse.yabesh.ir/std/handle/yse/212809
Collections :
  • IEEE - The Institute of Electrical and Electronics Engineers, Inc.
  • Download PDF : (1.572Mb)
  • Show Full MetaData Hide Full MetaData
  • Statistics

    IEEE 1149.8.1

Show full item record

contributor authorIEEE - The Institute of Electrical and Electronics Engineers, Inc.
date accessioned2017-09-04T18:30:29Z
date available2017-09-04T18:30:29Z
date copyright06/08/2012
date issued2012
identifier otherIWPWXEAAAAAAAAAA.pdf
identifier urihttps://yse.yabesh.ir/std/handle/yse/212809
description abstractThis standard specifies extensions to IEEE Std 1149.1™ that define the boundary-scan structures and methods required to facilitate boundary-scan-based stimulus of interconnections to passive and/or active components.1 Such networks are not adequately addressed by existing standards, including those networks that are ac-coupled or differential. The selective ac stimulus generation enabled by this standard, when combined with non-contact signal sensing, will allow testing of the connections between devices adhering to this standard and circuit elements such as series components, sockets, connectors, and integrated circuits (ICs) that do not implement IEEE Std 1149.1. This standard also specifies Boundary-Scan Description Language (BSDL) extensions to IEEE Std 1149.1 required to describe and support the new structures and methods.
Purpose
The purpose of this standard is to codify testability circuitry added to an IC incremental to the testability provisions specified by IEEE Std 1149.1. This will enable selective ac stimulus generation that, when combined with non-contact signal sensing, allows testing signal paths between devices adhering to this standard and passive and/or active components.
1Information on references can be found in Clause 2.
languageEnglish
titleIEEE 1149.8.1num
titleBoundary-Scan-Based Stimulus of Interconnections to Passive and/or Active Components - IEEE Computer Societyen
typestandard
page95
statusActive
treeIEEE - The Institute of Electrical and Electronics Engineers, Inc.:;2012
contenttypefulltext
DSpace software copyright © 2017-2020  DuraSpace
نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
yabeshDSpacePersian
 
DSpace software copyright © 2017-2020  DuraSpace
نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
yabeshDSpacePersian