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ECA EIA/ECA-747-A
Adhesive Backed Punched Plastic Carrier Taping of Singulated Bare Die and Other Surface Mount Components for Automatic Handling of Devices Generally Less Than 1.0 mm Thick
| contributor author | ECIA - Electronic Components Industry Association | |
| date accessioned | 2017-09-04T18:49:45Z | |
| date available | 2017-09-04T18:49:45Z | |
| date copyright | 02/01/2007 | |
| date issued | 2007 | |
| identifier other | KSRSXBAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/231109 | |
| description abstract | This Standard covers requirements for 8mn, 12mm, 16mm and 24mm taping of surface mount components generally less than 1.0mm thick and requiring high precision taping for automatic handling of devices such as singulated bare die. Refer to EIA-481 for the current Industry Standard for 8mm and 12 mm punched and 8mm to 24mm embossed taping requirements. | |
| language | English | |
| title | ECA EIA/ECA-747-A | num |
| title | Adhesive Backed Punched Plastic Carrier Taping of Singulated Bare Die and Other Surface Mount Components for Automatic Handling of Devices Generally Less Than 1.0 mm Thick | en |
| type | standard | |
| page | 22 | |
| status | Active | |
| tree | ECIA - Electronic Components Industry Association:;2007 | |
| contenttype | fulltext |
