IPC 2223D

English -- Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-10-18T11:09:09Z
date available	2017-10-18T11:09:09Z
date copyright	2016.09.01
date issued	2016
identifier other	WHQBSFAAAAAAAAAA.pdf
identifier uri	https://yse.yabesh.ir/std/handle/yse/235666
description abstract	Scope: This standard establishes the specific requirements for the design of flexible and rigid-flexible printed board applications and its forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced, dielectric in combination with metallic materials. These interconnecting boards may contain single, double, multilayer, or multiple conductive layers and can be comprised wholly of flex or a combination of both flex and rigid. Purpose The requirements contained herein are intended to establish specific design details that shall be used in conjunction with IPC-2221 and may also be used in conjunction with IPC-2222 for the rigid sections of rigid-flex circuits.
language	English
title	IPC 2223D	num
title	English -- Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards	en
type	standard
page	60
status	Active
tree	IPC - Association Connecting Electronics Industries:;2016
contenttype	fulltext