Abstract: To determine the resistance of the laminate to thermal stress in both the etched and unetched state.

Abstract: To measure the inside diameter of plated through holes in printed wiring boards.

Abstract: This test method will give an indication of activity of wave solder fluxes, core solder fluxes, and solder paste.

Abstract: This test method establishes a procedure for determining the low frequency out of plane dielectric constant and loss tangent of organic free films using a two-fluid method. (Low frequency is defined as less than or equal ...

Abstract: The purpose of this test is to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted elements to package headers or other substrates. This determination is based on a measure ...

Abstract: PURPOSE
The purpose of this investigation is to identify a stress test that will distinguish between robust and non-robust finishes. A robust finish will pass a test for solderability, and a non robust ...

Abstract: This test method shall establish and define the methods for predicting the bond strength, on a go-no-go basis, of additive rigid epoxy glass boards of the swelletchable type.

Abstract: Diese Spezifikation legt die allgemeinen Anforderungen an Leiterplatten sowie die Anforderungen an die Qualitätsund Zuverlässigkeitssicherung fest, die für ihre Beschaffung eingehalten werden müssen. ...

Abstract: This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for ...