NASA-LLIS-0794

Lessons Learned – Thermal Analysis of Electronic Assemblies to the Piece Part Level

contributor author	NASA - National Aeronautics and Space Administration (NASA)
date accessioned	2017-09-04T15:24:05Z
date available	2017-09-04T15:24:05Z
date copyright	04/17/2000
date issued	2000
identifier other	NHDEQCAAAAAAAAAA.pdf
identifier uri	https://yse.yabesh.ir/std/handle/yse/24425
description abstract	Practice: Perform a piece part thermal analysis that includes all piece parts in support of the part stress analysis. Also include fatigue sensitive elements of the assembly such as interconnects (solder joints, bondlines, wirebonds, etc.).
language	English
title	NASA-LLIS-0794	num
title	Lessons Learned – Thermal Analysis of Electronic Assemblies to the Piece Part Level	en
type	standard
page	4
status	Active
tree	NASA - National Aeronautics and Space Administration (NASA):;2000
contenttype	fulltext