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NASA-LLIS-0794
Lessons Learned – Thermal Analysis of Electronic Assemblies to the Piece Part Level
Year: 2000
Abstract: Practice:
Perform a piece part thermal analysis that includes all piece parts in support of the part stress analysis. Also include fatigue sensitive elements of the assembly such as interconnects (solder joints, bondlines, wirebonds, etc.).
Perform a piece part thermal analysis that includes all piece parts in support of the part stress analysis. Also include fatigue sensitive elements of the assembly such as interconnects (solder joints, bondlines, wirebonds, etc.).
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| contributor author | NASA - National Aeronautics and Space Administration (NASA) | |
| date accessioned | 2017-09-04T15:24:05Z | |
| date available | 2017-09-04T15:24:05Z | |
| date copyright | 04/17/2000 | |
| date issued | 2000 | |
| identifier other | NHDEQCAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/24425 | |
| description abstract | Practice: Perform a piece part thermal analysis that includes all piece parts in support of the part stress analysis. Also include fatigue sensitive elements of the assembly such as interconnects (solder joints, bondlines, wirebonds, etc.). | |
| language | English | |
| title | NASA-LLIS-0794 | num |
| title | Lessons Learned – Thermal Analysis of Electronic Assemblies to the Piece Part Level | en |
| type | standard | |
| page | 4 | |
| status | Active | |
| tree | NASA - National Aeronautics and Space Administration (NASA):;2000 | |
| contenttype | fulltext |