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NASA-LLIS-0561
Lessons Learned – Voyager Plated - Through Hole Failures (1976)
Year: 1997
Abstract: Abstract:
During initial testing of multi-layer circuit boards for Voyager, defective copper plating was found to have caused cracks in the barrels of plated-through holes. Recommendations involve monitoring of fabrication processes, performance of thermal cycling screening tests, and use of test coupons.
During initial testing of multi-layer circuit boards for Voyager, defective copper plating was found to have caused cracks in the barrels of plated-through holes. Recommendations involve monitoring of fabrication processes, performance of thermal cycling screening tests, and use of test coupons.
Subject: Hardware
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| contributor author | NASA - National Aeronautics and Space Administration (NASA) | |
| date accessioned | 2017-09-04T15:05:07Z | |
| date available | 2017-09-04T15:05:07Z | |
| date copyright | 07/31/1997 | |
| date issued | 1997 | |
| identifier other | LBCEQCAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/2545 | |
| description abstract | Abstract: During initial testing of multi-layer circuit boards for Voyager, defective copper plating was found to have caused cracks in the barrels of plated-through holes. Recommendations involve monitoring of fabrication processes, performance of thermal cycling screening tests, and use of test coupons. | |
| language | English | |
| title | NASA-LLIS-0561 | num |
| title | Lessons Learned – Voyager Plated - Through Hole Failures (1976) | en |
| type | standard | |
| page | 3 | |
| status | Active | |
| tree | NASA - National Aeronautics and Space Administration (NASA):;1997 | |
| contenttype | fulltext | |
| subject keywords | Hardware | |
| subject keywords | Parts Materials & Processes | |
| subject keywords | Test & Verification |