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IEC 62148-21

contributor authorIEC - International Electrotechnical Commission
date accessioned2020-09-15T22:28:49Z
date available2020-09-15T22:28:49Z
date copyright2019.03.01
date issued2019
identifier otherCQUJHGAAAAAAAAAA.pdf
identifier otherCQUJHGAAAAAAAAAA.pdf
identifier urihttps://yse.yabesh.ir/std/handle/yse/289119
description abstractScope: This part of IEC 62148 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages
languageEnglish, French
titleFrench -- Composants et dispositifs actifs fibroniques – Normes de boîtier et d'interface – Partie 21: Guide de conception de l'interface électrique des boîtiers PIC utilisant des boîtiers matriciels à billes et à pas fins en silicium (S-FBGA) et des boîtiers matriciels à zone de contact plate et à pas fins en silicium (S-FLGA) IEC - Edition 1.0|English -- Fibre optic active components and devices – Package and interface standards – Part 21: Design guide of electrical interface of PIC packages using silicon finepitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA) - Edition 1.0en
titleIEC 62148-21num
typestandard
page30
statusActive
treeIEC - International Electrotechnical Commission:;2019
contenttypefulltext


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