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Standard Specification for Materials for Copper Base Powder Metallurgy (PM) Structural Parts
ASTM B823-20
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ASTM - ASTM International
Year: 2024
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Standard Specification for Materials for Copper Base Powder Metallurgy (PM) Structural Parts
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| contributor author | ASTM - ASTM International | |
| date accessioned | 2025-09-30T18:04:02Z | |
| date available | 2025-09-30T18:04:02Z | |
| date copyright | 2024 | |
| date issued | 2024 | |
| identifier other | b0823-20r24.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/342048 | |
| language | English | |
| title | Standard Specification for Materials for Copper Base Powder Metallurgy (PM) Structural Parts | en |
| title | ASTM B823-20 | num |
| type | standard | |
| status | Active | |
| tree | ASTM - ASTM International:;2024 | |
| contenttype | fulltext | |
| scope | 1.1 This specification covers a variety of copper base powder metallurgy (PM) structural materials, including those used in applications where high electrical conductivity is required. It includes a classification system, or material designation code. With the classification system, this specification includes chemical composition and minimum tensile yield strength. Note 1: Paragraphs 6.1 and 8.1 govern material classification by the designation code. The classification system is explained in the Appendix. Note 2: Materials classified as C-0000 are expected to be used in applications where high electrical conductivity is required. 1.2 Units—With the exception of density values, for which the gram per cubic centimetre (g/cm3) unit is the industry standard, the values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard. 1.3 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee. | |
| identifier DOI | 10.1520/B0823-20R24 |