TIA TIA-455-15A

Abstract

<strong>INTRODUCTION</strong> <br>Intent.¹ The intent of this test is to demonstrate the ability of a fiber optic component device-to-cable attachment(s), and any interface area of mated component device seals, to perform satisfactorily during, and subsequent to, simulated rapid descents from high altitude, with attendant moisture condensation. Typically, fiber optic interconnecting devices are most commonly tested by this method, but the methodology can be applied to various other types of fiber optic components. <br><strong>Alternative Method.</strong> This test is similar to that prescribed by FOTP-190, except that specimens tested under FOTP-190 are not immersed in water during low pressure exposure. Also , FOTP-190 provides a wider choice of test pressures than does FOTP-15. <br><strong>Failure Modes</strong>. The potential failure modes for this test include, but are not limited to: <br>a. Unacceptable changes in optical transmittance, <br>b. Unacceptable changes in insertion loss, <br>c. Unacceptable changes in return loss, <br>d. Damage to device seals., <br>e. Other failure modes (such as changes in engagement and separation forces) may be specified by the Detail Specification. <br>¹This method is similar to Method 1004.1 of MIL-STD-1344. However, the MIL-STD requires immersion in a salt solution, while this method uses distilled water immersion only.