GSFC-STD-6001

Ceramic Column Grid Array Design and Manufacturing Rules for Flight Hardware

contributor author	GSFC - NASA - GSFC - Robert H. Goddard Space Flight Center
date accessioned	2017-09-04T16:08:48Z
date available	2017-09-04T16:08:48Z
date copyright	02/22/2011
date issued	2011
identifier other	SFDNUEAAAAAAAAAA.pdf
identifier uri	https://yse.yabesh.ir/std/handle/yse/72073
description abstract	Purpose The purpose of this standard is to provide requirements and recommendations intended to facilitate production of defect-free ceramic column grid array solder joint interconnects to boards intended for use in space flight applications (refer to Appendix A, Technology Background). This standard does not provide application specific reliability test requirements (e.g. qualification requirements). Applicability This standard is applicable to all uses on flight hardware of ceramic packaged electronic parts which are solder-attached to printed circuit boards with solder columns (ceramic column grid array attachments or CCGAs).
language	English
title	GSFC-STD-6001	num
title	Ceramic Column Grid Array Design and Manufacturing Rules for Flight Hardware	en
type	standard
page	21
status	Active
tree	GSFC - NASA - GSFC - Robert H. Goddard Space Flight Center:;2011
contenttype	fulltext