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GSFC-STD-6001
Ceramic Column Grid Array Design and Manufacturing Rules for Flight Hardware
Year: 2011
Abstract: Purpose
The purpose of this standard is to provide requirements and recommendations intended to facilitate production of defect-free ceramic column grid array solder joint interconnects to boards intended for use in space flight applications (refer to Appendix A, Technology Background). This standard does not provide application specific reliability test requirements (e.g. qualification requirements).
Applicability
This standard is applicable to all uses on flight hardware of ceramic packaged electronic parts which are solder-attached to printed circuit boards with solder columns (ceramic column grid array attachments or CCGAs).
The purpose of this standard is to provide requirements and recommendations intended to facilitate production of defect-free ceramic column grid array solder joint interconnects to boards intended for use in space flight applications (refer to Appendix A, Technology Background). This standard does not provide application specific reliability test requirements (e.g. qualification requirements).
Applicability
This standard is applicable to all uses on flight hardware of ceramic packaged electronic parts which are solder-attached to printed circuit boards with solder columns (ceramic column grid array attachments or CCGAs).
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| contributor author | GSFC - NASA - GSFC - Robert H. Goddard Space Flight Center | |
| date accessioned | 2017-09-04T16:08:48Z | |
| date available | 2017-09-04T16:08:48Z | |
| date copyright | 02/22/2011 | |
| date issued | 2011 | |
| identifier other | SFDNUEAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/72073 | |
| description abstract | Purpose The purpose of this standard is to provide requirements and recommendations intended to facilitate production of defect-free ceramic column grid array solder joint interconnects to boards intended for use in space flight applications (refer to Appendix A, Technology Background). This standard does not provide application specific reliability test requirements (e.g. qualification requirements). Applicability This standard is applicable to all uses on flight hardware of ceramic packaged electronic parts which are solder-attached to printed circuit boards with solder columns (ceramic column grid array attachments or CCGAs). | |
| language | English | |
| title | GSFC-STD-6001 | num |
| title | Ceramic Column Grid Array Design and Manufacturing Rules for Flight Hardware | en |
| type | standard | |
| page | 21 | |
| status | Active | |
| tree | GSFC - NASA - GSFC - Robert H. Goddard Space Flight Center:;2011 | |
| contenttype | fulltext |