NASA-LLIS-0314

Lessons Learned – Contamination, Silicone; Effect on Bonding

contributor author	NASA - National Aeronautics and Space Administration (NASA)
date accessioned	2017-09-04T16:21:13Z
date available	2017-09-04T16:21:13Z
date copyright	04/15/1993
date issued	1993
identifier other	TNAEQCAAAAAAAAAA.pdf
identifier uri	https://yse.yabesh.ir/std/handle/yse/84706
description abstract	Description of Driving Event: Silicone was used to compensate for the differences in coefficient of thermal expansion between electrical components and the basic epoxy module material. The silicone was transferred in some manner to the module baseplates and resulted in a poor bond and subsequent cracking.
language	English
title	NASA-LLIS-0314	num
title	Lessons Learned – Contamination, Silicone; Effect on Bonding	en
type	standard
page	2
status	Active
tree	NASA - National Aeronautics and Space Administration (NASA):;1993
contenttype	fulltext
subject keywords	Hardware