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NASA-LLIS-0314
Lessons Learned – Contamination, Silicone; Effect on Bonding
Year: 1993
Abstract: Description of Driving Event:
Silicone was used to compensate for the differences in coefficient of thermal expansion between electrical components and the basic epoxy module material. The silicone was transferred in some manner to the module baseplates and resulted in a poor bond and subsequent cracking.
Silicone was used to compensate for the differences in coefficient of thermal expansion between electrical components and the basic epoxy module material. The silicone was transferred in some manner to the module baseplates and resulted in a poor bond and subsequent cracking.
Subject: Hardware
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| contributor author | NASA - National Aeronautics and Space Administration (NASA) | |
| date accessioned | 2017-09-04T16:21:13Z | |
| date available | 2017-09-04T16:21:13Z | |
| date copyright | 04/15/1993 | |
| date issued | 1993 | |
| identifier other | TNAEQCAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/84706 | |
| description abstract | Description of Driving Event: Silicone was used to compensate for the differences in coefficient of thermal expansion between electrical components and the basic epoxy module material. The silicone was transferred in some manner to the module baseplates and resulted in a poor bond and subsequent cracking. | |
| language | English | |
| title | NASA-LLIS-0314 | num |
| title | Lessons Learned – Contamination, Silicone; Effect on Bonding | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | NASA - National Aeronautics and Space Administration (NASA):;1993 | |
| contenttype | fulltext | |
| subject keywords | Hardware |