MIL-M-24519E

MOLDING PLASTICS, ELECTRICAL, THERMOPLASTIC

Year: 1992

Abstract: This specification covers the basic properties of thermoplastic molding compounds used to mold electric and electronic component parts.
The thermoplastic molding compounds governed by this specification are of the following types, as specified (see 6.2). 
      Type                            Description       PT-F     Thermoplastic polyester (polytetramethylene terephthalate or poly                  1, 4 butylene terephthalate) compound, flame resistant.       GPT-7.5F Thermoplastic polyester (polytetramethylene terephthalate or poly                  1, 4 butylene terephthalate) compound, 7.5 percent glass                  reinforced, flame resistant.       GPT-15F  Thermoplastic polyester (polytetramethylene terephthalate or poly                  1, 4 butylene terephthalate compound, 20 percent glass                  reinforced, flame resistant.

Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Commander, Naval Sea Systems Command, SEA 55Z3, Department of the Navy, Washington, DC 20362-5101 by using the self-addressed Standardization Document, Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. 
 Types           Description  GPT-20F  Thermoplastic polyester (polytetramethylene terephthalate or poly             1, 4 butylene terephthalate compound, 20 percent glass             reinforced, flame resistant.  GCT-30F  Thermoplastic polyester (1, 4-cylohexylenedimethylene             terephthalate -(PCT) compound, 30 percent fiber reinforced, flame             retardant.  GPT-30F  Thermoplastic polyester (polytetramethylene terephthalate or poly             1, 4 butylene terephthalate) compound, 30 percent glass             reinforced, flame resistant.  GAT-22F  Thermoplastic, polyarylether compound, 22 percent glass             reinforced, flame resistant.  GET-30F  Thermoplastic polyester (polyethylene terephthalate) compound, 30             percent glass reinforced, flame resistant.  GET-35F  Thermoplastic polyethylene terephthalate compound, 35 percent             glass reinforced, flame retardant.  GMT-40F  Thermoplastic polyester (polytetramethylene terephthalate or poly             1, 4 butylene terephthalate) compound, 40 percent glass and             mineral reinforced, flame resistant.  GLT-10F  Thermoplastic polyetherimide compound, 10 percent glass             reinforced, flame resistant.  GLT-20F  Thermoplastic polyetherimide compound, 20 percent glass             reinforced, flame resistant.  GLT-30F  Thermoplastic polyetherimide compound, 30 percent glass             reinforced, flame resistant.  GST-40F  Thermoplastic polyphenylene sulfide compound, 40 percent glass             reinforced, flame resistant.  MLT-20F  - Mineral plastic polytherimide compound, 20 percent mineral filled,             flame resistant.  GLCP-30F Thermoplastic polyester, 30 percent glass reinforced liquid             crystalline.  GLCP-50F Thermoplastic polyester, 50 percent glass reinforced liquid             crystalline.


Intended Use: The general purpose thermoplastic compounds covered by this specification are intended for applications requiring good electrical and mechanical properties. The compounds are used in electronic connectors and similar applications. Flame retardants reduce arc tracking resistance of the compounds and should not be used in applications above 300 volts.
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