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NASA-LLIS-0429
Lessons Learned – Low Strength Solder Joints (~1975)
Year: 1996
Abstract: Abstract:
In the process of reflow soldering flat pack leads to printed circuit boards during the Voyager program, it was discovered that a high phosphorous content in the plating process for the Kovar leads can weaken solder joints. Evaluate the effects of phosphorus when soldering or welding nickel plated surfaces.
In the process of reflow soldering flat pack leads to printed circuit boards during the Voyager program, it was discovered that a high phosphorous content in the plating process for the Kovar leads can weaken solder joints. Evaluate the effects of phosphorus when soldering or welding nickel plated surfaces.
Subject: Hardware
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| contributor author | NASA - National Aeronautics and Space Administration (NASA) | |
| date accessioned | 2017-09-04T17:18:29Z | |
| date available | 2017-09-04T17:18:29Z | |
| date copyright | 07/15/1996 | |
| date issued | 1996 | |
| identifier other | ZLBEQCAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std/handle/yse/141842 | |
| description abstract | Abstract: In the process of reflow soldering flat pack leads to printed circuit boards during the Voyager program, it was discovered that a high phosphorous content in the plating process for the Kovar leads can weaken solder joints. Evaluate the effects of phosphorus when soldering or welding nickel plated surfaces. | |
| language | English | |
| title | NASA-LLIS-0429 | num |
| title | Lessons Learned – Low Strength Solder Joints (~1975) | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | NASA - National Aeronautics and Space Administration (NASA):;1996 | |
| contenttype | fulltext | |
| subject keywords | Hardware | |
| subject keywords | Industrial Operations | |
| subject keywords | Parts Materials & Processes |