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NASA-LLIS-0275
Lessons Learned – Stressed or Damaged Solder Joints on Flight Hardware Due to Thermal Cycling
| contributor author | NASA - National Aeronautics and Space Administration (NASA) | |
| date accessioned | 2017-09-04T17:20:44Z | |
| date available | 2017-09-04T17:20:44Z | |
| date copyright | 07/09/1993 | |
| date issued | 1993 | |
| identifier other | ZQZCQCAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std/handle/yse/143913 | |
| description abstract | Abstract: Over the years, numerous incidents of failed solder joints have occurred to electronic equipment at JPL and contractor facilities. The problem was traced to thermal cycling of conformal coatings. The lesson recommendations pertain to prediction of the thermal cycling environment, application of conformal coatings, packaging design reviews, and packaging design and fabrication processes, procedures, and documentation. | |
| language | English | |
| title | NASA-LLIS-0275 | num |
| title | Lessons Learned – Stressed or Damaged Solder Joints on Flight Hardware Due to Thermal Cycling | en |
| type | standard | |
| page | 3 | |
| status | Active | |
| tree | NASA - National Aeronautics and Space Administration (NASA):;1993 | |
| contenttype | fulltext | |
| subject keywords | Environment | |
| subject keywords | Flight Equipment | |
| subject keywords | Hardware | |
| subject keywords | Industrial Operations | |
| subject keywords | Parts Materials & Processes |
