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NASA-LLIS-0275

Lessons Learned – Stressed or Damaged Solder Joints on Flight Hardware Due to Thermal Cycling

Organization:
NASA - National Aeronautics and Space Administration (NASA)
Year: 1993

Abstract: Abstract:
Over the years, numerous incidents of failed solder joints have occurred to electronic equipment at JPL and contractor facilities. The problem was traced to thermal cycling of conformal coatings.
The lesson recommendations pertain to prediction of the thermal cycling environment, application of conformal coatings, packaging design reviews, and packaging design and fabrication processes, procedures, and documentation.
URI: http://yse.yabesh.ir/std/handle/yse/143913
Subject: Environment
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  • NASA - National Aeronautics and Space Administration (NASA)
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    NASA-LLIS-0275

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contributor authorNASA - National Aeronautics and Space Administration (NASA)
date accessioned2017-09-04T17:20:44Z
date available2017-09-04T17:20:44Z
date copyright07/09/1993
date issued1993
identifier otherZQZCQCAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std/handle/yse/143913
description abstractAbstract:
Over the years, numerous incidents of failed solder joints have occurred to electronic equipment at JPL and contractor facilities. The problem was traced to thermal cycling of conformal coatings.
The lesson recommendations pertain to prediction of the thermal cycling environment, application of conformal coatings, packaging design reviews, and packaging design and fabrication processes, procedures, and documentation.
languageEnglish
titleNASA-LLIS-0275num
titleLessons Learned – Stressed or Damaged Solder Joints on Flight Hardware Due to Thermal Cyclingen
typestandard
page3
statusActive
treeNASA - National Aeronautics and Space Administration (NASA):;1993
contenttypefulltext
subject keywordsEnvironment
subject keywordsFlight Equipment
subject keywordsHardware
subject keywordsIndustrial Operations
subject keywordsParts Materials & Processes
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