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NASA-LLIS-0809
Lessons Learned – Heat Sinks for Parts Operated in Vacuum
Year: 2000
Abstract: Practice:
Perform a thermal analysis of each electronic assembly to the piece-part level. Provide a heat conduction path for all parts whose junction temperature rise exceeds 35°C above the cold plate.
Perform a thermal analysis of each electronic assembly to the piece-part level. Provide a heat conduction path for all parts whose junction temperature rise exceeds 35°C above the cold plate.
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| contributor author | NASA - National Aeronautics and Space Administration (NASA) | |
| date accessioned | 2017-09-04T17:25:42Z | |
| date available | 2017-09-04T17:25:42Z | |
| date copyright | 04/17/2000 | |
| date issued | 2000 | |
| identifier other | CIDEQCAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std/handle/yse/148753 | |
| description abstract | Practice: Perform a thermal analysis of each electronic assembly to the piece-part level. Provide a heat conduction path for all parts whose junction temperature rise exceeds 35°C above the cold plate. | |
| language | English | |
| title | NASA-LLIS-0809 | num |
| title | Lessons Learned – Heat Sinks for Parts Operated in Vacuum | en |
| type | standard | |
| page | 5 | |
| status | Active | |
| tree | NASA - National Aeronautics and Space Administration (NASA):;2000 | |
| contenttype | fulltext |