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IPC TM-650 2.4.9D
Peel Strength, Flexible Printed Wiring Materials
Organization:
IPC - Association Connecting Electronics Industries
Year: 1988
Abstract: This test method defines the procedure for determining the bond strength of copper foil clad flexible dielectric material.
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IPC TM-650 2.4.9D
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:21:49Z | |
| date available | 2017-09-04T17:21:49Z | |
| date copyright | 32417 | |
| date issued | 1988 | |
| identifier other | ZUFTCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/145017 | |
| description abstract | This test method defines the procedure for determining the bond strength of copper foil clad flexible dielectric material. | |
| language | English | |
| title | IPC TM-650 2.4.9D | num |
| title | Peel Strength, Flexible Printed Wiring Materials | en |
| type | standard | |
| page | 5 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1988 | |
| contenttype | fulltext |