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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 81-100 of 793
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IPC TM-650 2.5.25A
Abstract: This test method describes the test procedure required to measure the dielectric strength of flexible flat cable. -
IPC TM-650 2.2.14.1
Abstract: This test specifies a standard procedure for estimating the particle size and the particle shape of solder powder in solder pastes by microscopic methods. -
IPC TM-650 2.3.8.1
Abstract: This test method exists to determine the degree of flame resistance of flexible printed wiring. -
IPC TM-650 2.5.5.6
Abstract: The full sheet resonance (FSR) method is a means for non-destructive measurement of relative permittivity (K') of clad laminates at microwave frequencies.
Applicability: The FSR method is applicable to rectangular ... -
IPC 1755
Abstract: This standard establishes the requirements for exchanging conflict minerals data between suppliers and their customers. To meet the needs of a broad range of users, this standard provides flexibility in the scope of the ... -
IPC TM-650 2.3.7.2A
Abstract: This method is a means for preparation of test specimens for determination of bare dielectric material quality and properties, using an alkaline etching solution for removal of copper cladding. -
IPC TM-650 2.4.15A
Abstract: A test method for measuring the geometric irregularities (roughness, waviness, etc.) of the surface of metal foils. -
IPC 2316
Abstract: Statement of Scope This document is a guide to established and emerging embedded passive materials and technologies. It should not be used as an endorsement of any particular material or company product. ... -
IPC TM-650 2.4.39A
Abstract: This procedure defines a test method used to determine dimensional stability of glass reinforced, copperclad, thin laminates intended for use in rigid multilayer printed boards. The test is appropriate for checking material ... -
IPC TM-650 2.4.6
Abstract: The determination of lamination bond quality by immersion in an oil stabilizing high temperature bath. -
IPC 7527
Abstract: This standard is a collection of visual quality acceptability criteria for solder paste printing.
Purpose
The purpose of this guideline document is to support the user in the visual evaluation of ... -
IPC TM-650 2.3.34C
Abstract: This test method is designed to determine the residual solids content of flux after evaporation of the volatile chemicals from within the flux; typically 15% by weight minimum. -
IPC J-STD-004B
Abstract: This standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. This standard may be used for quality control and procurement purposes. ... -
IPC TM-650 2.5.6.2A
Abstract: This method describes a technique for evaluating the ability of an insulating material to resist electrical breakdown perpendicular to the plane of the material when subjected to short term, high voltages at standard AC ... -
IPC TM-650 2.5.6.3
Abstract: These methods are designed for use in determining the dielectric strength of solid electrical insulating materials.