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JEDEC - Solid State Technology Association: Recent submissions
Now showing items 181-200 of 369
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JEDEC JESD7-A
Abstract: This standard provides uniformity, multiplicity of sources, eliminate confusion, and ease of device specification and design by users for HC, and HCT CMOS devices. This standard specifies electrical parameters. It also ...Subject(s) : CMOS Devices - High Speed , High Speed - CMOS Devices , -
JEDEC JESD51-9
Abstract: This standard covers the design of printed circuit boards (PCBs) used in the thermal characterization of ball grid array (BGA) and land grid array (LGA) packages. It is intended to be used in conjunction with the JESD51 ...Subject(s) : Area Array , Test Board , Thermal Measurements , -
JEDEC JESD671B
Abstract: The scope of this standard includes any customer-initiated component problem analysis/corrective action request and supplier-identified component nonconformance to specification which may impact the customer.
This ... -
JEDEC JEP128
Abstract: This guide was developed to expedite inter-laboratory experiments used to evaluate or develop standard test methods that involve test-structure measurements or tests. It also facilitates, generally, any electrical tests ...Subject(s) : Probe - Pad Sizes and Layouts , Wafer Level Electrical Testing , -
JEDEC JESD93
Abstract: This specification establishes the general requirements for hybrid microcircuits, RF/microwave hybrid microcircuits and MCMs (hereafter referred to as devices). Detailed performance requirements for a specific device are ...Subject(s) : Hybrids , MCM , microcircuits , microwave , -
JEDEC JESD84-A41
Abstract: This document provides a definition of the Embedded MultiMediaCard product, its environment, and handling. It also provides design guidelines and defines a tool box of macro functions and algorithms intended to reduce ...Subject(s) : Capacity , Embedded , eMMC , eMMC 4.1 , Multi Media , -
JEDEC JESD63
Abstract: This method provides procedures to calculate sample estimates and their confidence intervals for the electromigration model parameters of current density and temperature. The model parameter for current density is the ...Subject(s) : Current Density , Electromigration , -
JEDEC JESD51
Abstract: This standard and its subsequent addendum's, provides a standard for thermal measurement that, if followed fully, will provide correct and meaningful data that will allow for determination of junction temperature for ...Subject(s) : Single Semiconductor Device , Thermal Measurement - Component Packages , -
JEDEC JESD84-A42
Abstract: This document provides a definition of the Embedded MultiMediaCard product, its environment, and handling. It also provides design guidelines and defines a tool box of macro functions and algorithms intended to reduce ...Subject(s) : Embedded , eMMC , High Capacity , MMC , MMCA , product , -
JEDEC JESD89-2A
Abstract: This test method is offered as standardized procedure to determine the alpha particle Soft Error Rate (SER) sensitivity of solid state volatile memory arrays and bistable logic elements (e.g. flipflops) by measuring the ...Subject(s) : alpha , americium , hardness , radiation , SER , soft error , thorium , -
JEDEC JEP709
Abstract: This guideline provides terms and definitions for "low-halogen" solid state devices and recommends methods for marking and labeling. This document may be applied to all nonmetallic and nonceramic materials of solid state ... -
JEDEC JESD22-B100B
Abstract: The standard provides a method for determining whether the external physical dimensions of the device are in accordance with the applicable procurement document. This revision includes a change in details to be specified ...Subject(s) : Physical Dimensions , Test Method - Physical Dimension , -
JEDEC JESD22-A108D
Abstract: This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the devices' operating condition in an accelerated way, and is primarily for device qualification ... -
JEDEC JEP148A
Abstract: A concept is outlined, which proactively integrates qualification into the development process and provides a systematic procedure as support tool to development and gives early focus on required activities. It converts ...Subject(s) : Opportunity Assessment , Physics of Failure , Qualification , Reliability , -
JEDEC JESD22-A115C
Abstract: This method establishes a standard procedure for testing microcircuits using an electrostatic discharge (ESD) model known commonly in the industry as the Machine Model (MM). The objective is to provide reliable, repeatable ... -
JEDEC JEP134
Abstract: The purpose of this Guideline is to provide a vehicle for acquiring and transmitting the necessary information in a concise, organized, and consistent format. Included in the Guideline is a sample form that facilitates ...Subject(s) : Catastrophic Failure , Customer-Supplied Background Information , Failure Analysis Laboratory , Functional Failure , Parametric Failure , Programming Failure , Semiconductor Device Failure , Timing Failure , -
JEDEC JESD22-B104C
Abstract: The Mechanical Shock Test Method is intended to evaluate component(s) for use in electrical equipment. It is intended to determine the compatibility of the component(s) to withstand moderately severe shocks as a result of ... -
JEDEC JEP114.01
Abstract: This publication was developed to help the user of this test methodology avoid common interference Æs to successful application. The guide contains sections on typical specification requirements, sources of ...Subject(s) : Certification - PIND Testing , Noise Detection - Particle Impact , Operator Training - PIND Testing , PIND - Particle Impact Noise Detection , -
JEDEC JESD8-7A
Abstract: This standard continues the voltage specification migration to the next level beyond the 2.5 V specification already established. Since this migration is driven by both process changes and performance/power, more entries ...Subject(s) : Nonterminated - Digital Integrated Circuits , Normal Range - Power Supply Voltage , Wide Range - Power Supply Voltage ,