Now showing items 321-340 of 369

    • JEDEC JESD82-22 

      Type: standard
      Source: JEDEC - Solid State Technology Association:;2006
      Organization : JEDEC - Solid State Technology Association
      Abstract: This device is a one-chip spectrum analyzer that operates in the frequency range from 1 to 2 GHz. It requires no external components except some filtering of the voltage supply (one inductor, one bypass capacitor). The ...
      Subject(s) : Diagnostic , FBD , FBDIMM , Instrumentation Chip , Senselines ,
    • JEDEC JESD24-8 

      Type: standard
      Source: JEDEC - Solid State Technology Association:;2002
      Organization : JEDEC - Solid State Technology Association
      Abstract: Determines the repetitive inductive avalanche switching capability of power switching transistors.
      Subject(s) : Avalanche Switching , Test Method - Repetitive Inductive Load Avalanche Switching ,
    • JEDEC JESD218A 

      Type: standard
      Source: JEDEC - Solid State Technology Association:;2011
      Organization : JEDEC - Solid State Technology Association
      Abstract: This standard defines JEDEC requirements for solid state drives. For each defined class of solid state drive, the standard defines the conditions of use and the corresponding endurance verification requirements. Although ...
    • JEDEC JESD302 

      Type: standard
      Source: JEDEC - Solid State Technology Association:;2009
      Organization : JEDEC - Solid State Technology Association
      Abstract: PURPOSE OF STANDARDS
      These standards, adopted by the Electronic Industries Association and issued jointly by the Electronic Industries Association and the National Electrical Manufacturers Association, ...
    • JEDEC JEP138 

      Type: standard
      Source: JEDEC - Solid State Technology Association:;1999
      Organization : JEDEC - Solid State Technology Association
      Abstract: The purpose of these user guidelines is to provide background and an example for the use of an infrared (IR) microscope to determine die temperature of electronic devices for calculations such as thermal resistance. 
      Subject(s) : Die Temperature , IR - Infrared , IR Thermal Imaging ,
    • JEDEC JEP110 

      Type: standard
      Source: JEDEC - Solid State Technology Association:;1988
      Organization : JEDEC - Solid State Technology Association
      Abstract: This publication is intended for power GaAs FET applications requiring high reliability. An accurate measurement of thermal resistance is extremely important to provide the user with knowledge of the FETs operating temperature ...
      Subject(s) : GaAs FETs , Measurement - Thermal Resistance of GaAs FETs , Thermal Resistance - GaAs FETs ,
    • JEDEC JESD82-13A 

      Type: standard
      Source: JEDEC - Solid State Technology Association:;2005
      Organization : JEDEC - Solid State Technology Association
      Abstract: This standard defines standard specifications of dc interface parameters, switching parameters, and test loading for definition of the SSTVN16859 13-bit to 26-bit SSTL_2 registered buffer for PC1600, PC2100, PC2700 and ...
      Subject(s) : 16859 , PC1600 , PC2100 , PC2700 , PC3200 , Register , SSTL_2 , SSTVN16859 ,
    • JEDEC JESD73-4 

      Type: standard
      Source: JEDEC - Solid State Technology Association:;2001
      Organization : JEDEC - Solid State Technology Association
      Abstract: This standard provides a set of uniform data sheet parameters for the description of a dual 5-bit, 2.5 V FET transmission-gate bus switch device for DDR memory module and motherboard applications. This bus switch device ...
      Subject(s) : Bus Switch , DDR , FET Switch ,
    • JEDEC JESD51-5 

      Type: standard
      Source: JEDEC - Solid State Technology Association:;1999
      Organization : JEDEC - Solid State Technology Association
      Abstract: This extension of the thermal standards provides a standard fixture for direct attach type packages such as deep-downset of thermally tabbed packages. This specification provides additional design detail for use in developing ...
      Subject(s) : Direct Attach Type Packages , Thermal Test , Thermally Tabbed Packages ,
    • JEDEC JESD31D 

      Type: standard
      Source: JEDEC - Solid State Technology Association:;2010
      Organization : JEDEC - Solid State Technology Association
      Abstract: This publication identifies the general requirements for Distributors that supply Commercial and Military products. This standard applies to all discrete semiconductors, integrated circuits and Hybrids, whether packaged ...
    • JEDEC JESD221 

      Type: standard
      Source: JEDEC - Solid State Technology Association:;2011
      Organization : JEDEC - Solid State Technology Association
      Abstract: This standard applies generally to gas proportional instruments and the use thereof in measuring materials with an alpha emissivity of less than 10 ·khr-1·cm-2. The primary focus ...
    • JEDEC JEP133C 

      Type: standard
      Source: JEDEC - Solid State Technology Association:;2010
      Organization : JEDEC - Solid State Technology Association
      Abstract: A revised and expanded publication for suppliers and users of radiation hardness assured (RHA) multichip modules (MCMs) and hybrid microcircuits, is now available. Revision A of JEP133 includes modifications to the ...
      Subject(s) : Hybrid Microcircuits , Multichip Module , Radiation-Hardness ,
    • JEDEC JESD79F 

      Type: standard
      Source: JEDEC - Solid State Technology Association:;2010
      Organization : JEDEC - Solid State Technology Association
    • JEDEC JESD220B 

      Type: standard
      Source: JEDEC - Solid State Technology Association:;2013
      Organization : JEDEC - Solid State Technology Association
      Abstract: This standard specifies the characteristics of the UFS electrical interface and the memory device. Such characteristics include (among others) low power consumption, high data throughput, low  electromagnetic ...
    • JEDEC JESD72 

      Type: standard
      Source: JEDEC - Solid State Technology Association:;2007
      Organization : JEDEC - Solid State Technology Association
      Abstract: This Test Method covers the minimum requirements that should be in effect for the evaluation and acceptance of polymeric materials for use in industrial, military, space, and other special-condition products which may ...
      Subject(s) : Evaluation - Polymeric Materials , Polymeric Material , Test Method - Polymeric Materials ,
    • JEDEC JESD12-1B 

      Type: standard
      Source: JEDEC - Solid State Technology Association:;1993
      Organization : JEDEC - Solid State Technology Association
      Abstract: The purpose of this standard is to promote the uniform use of abbreviations, terms, and definitions throughout the semiconductor industry. It is a useful guide for users, manufactures, educators, technical writers, and ...
      Subject(s) : Gate Array , Semicustom Integrated Circuits , Terms and Definitions - Cell-Based , Terms and Definitions - Gate Array ,
    • JEDEC JESD8-6 

      Type: standard
      Source: JEDEC - Solid State Technology Association:;1995
      Organization : JEDEC - Solid State Technology Association
      Abstract: This standard is a 1.5 volt high performance CMOS-based interface document suitable for high I/O count CMOS and BiCMOS devices operating at frequencies in excess of 200 Mhz.
      Subject(s) : BiCMOS , CMOS , High Speed Transceiver Logic - HSTL , Output Buffer Supply Voltage ,
    • JEDEC JESD24-7 

      Type: standard
      Source: JEDEC - Solid State Technology Association:;2002
      Organization : JEDEC - Solid State Technology Association
      Abstract: Defines methods for verifying the diode recovery stress capability of power transistors. 
      Subject(s) : Diode Safe Operating Area , Measurement - dv/dt During Reverse Recovery , Power Transistors ,
    • JEDEC J-STD-609A.01 

      Type: standard
      Source: JEDEC - Solid State Technology Association:;2011
      Organization : JEDEC - Solid State Technology Association
      Abstract: This standard applies to components and assemblies that contain Pb-free and Pb-containing solders and finishes. This standard describes the marking of components and the labeling of their shipping containers to identify ...
      Subject(s) : Labeling , Marking , Pb , PB-Free , PCB ,
    • JEDEC JESD80 

      Type: standard
      Source: JEDEC - Solid State Technology Association:;1999
      Organization : JEDEC - Solid State Technology Association
      Abstract: The purpose of this standard is to provide a standard for 2.5 V nominal supply-voltage CMOS logic devices, for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. ...
      Subject(s) : CMOS Logic Devices , DC Interface Parameters , Nominal Supply Voltage - 2.5 V , Operating Voltages ,