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JEDEC JEP143C
Solid-State Reliability Assessment and Qualification Methodologies
Organization:
JEDEC - Solid State Technology Association
Year: 2012
Abstract: This publication applies to all integrated circuits and their associated packages. The document summarizes the suite of reliability documents and publications available. These documents address reliability qualification, reliability stress testing, and reliability modeling.
The purpose of this publication is to provide an overview of some of the most commonly used systems and test methods historically performed by manufacturers to assess and qualify the reliability of solid-state products. The appropriate references to existing and proposed JEDEC or joint standards and publications are cited. This document is also intended to provide an educational background and overview of some of the technical and economic factors associated with assessing and qualifying microcircuit reliability.
The purpose of this publication is to provide an overview of some of the most commonly used systems and test methods historically performed by manufacturers to assess and qualify the reliability of solid-state products. The appropriate references to existing and proposed JEDEC or joint standards and publications are cited. This document is also intended to provide an educational background and overview of some of the technical and economic factors associated with assessing and qualifying microcircuit reliability.
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| contributor author | JEDEC - Solid State Technology Association | |
| date accessioned | 2017-09-04T15:27:37Z | |
| date available | 2017-09-04T15:27:37Z | |
| date copyright | 07/01/2012 | |
| date issued | 2012 | |
| identifier other | NRXKXEAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;quein=autho123393FD081DAC4/handle/yse/28573 | |
| description abstract | This publication applies to all integrated circuits and their associated packages. The document summarizes the suite of reliability documents and publications available. These documents address reliability qualification, reliability stress testing, and reliability modeling. The purpose of this publication is to provide an overview of some of the most commonly used systems and test methods historically performed by manufacturers to assess and qualify the reliability of solid-state products. The appropriate references to existing and proposed JEDEC or joint standards and publications are cited. This document is also intended to provide an educational background and overview of some of the technical and economic factors associated with assessing and qualifying microcircuit reliability. | |
| language | English | |
| title | JEDEC JEP143C | num |
| title | Solid-State Reliability Assessment and Qualification Methodologies | en |
| type | standard | |
| page | 37 | |
| status | Active | |
| tree | JEDEC - Solid State Technology Association:;2012 | |
| contenttype | fulltext |