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ECIA - Electronic Components Industry Association: Recent submissions
Now showing items 221-240 of 507
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ECA EIA-364-108
Abstract: This procedure applies to interconnect assemblies, such as electrical connectors, and cable assemblies.
Object
This standard describes test methods to measure impedance, reflection coefficient, return loss, and ... -
ECA EIA-945
Abstract: Description
This specification defines the qualification program for surface mount inductors. The qualification program is defined in Table 1. Specification sheets can be added, as required, to define ... -
ECA JEDEC/ECA JS709
Abstract: This standard provides terms and definitions for "low-halogen" passive and solid state devices and recommends methods for marking and labeling. This standard may be applied to all nonmetallic and nonceramic materials of ... -
ECA TEB 27
Abstract: INTRODUCTION
A great deal of confusion exists about the precise meaning of the terms Resolution and Addressability as applied to display systems, Additionally, once clarity of meaning ... -
ECA IS-34
Abstract: This industry standard covers the general requirements for cermet or metal film type resistor networks, primarily intended for incorporation into electronic circuits.
Classification
Networks specified herein (see ... -
ECA RS-209-A
Abstract: INTRODUCTION
This Standard supersedes RS-209 and RS-209-1. It includes all items prepared by JEDEC Committee JT-8 on Mechanical Standardization, and approved by the Electronic Industries Association ... -
ECA EIA-364-65B
Abstract: This standard establishes the test procedure for producing environmentally related corrosive atmospheres to determine the reaction of plated or unplated surfaces when exposed to different concentrations of flowing gas ... -
ECA EIA-364-29C
Abstract: This standard establishes a test method to impose axial forces on the connector contacts to determine the ability of the connector to withstand forces that tend to displace contacts from their proper location within the ... -
ECA 186-6E
Abstract: PURPOSE
These tests are intended to determine the ability of terminals to withstand the usual stresses which may be applied during assembly or disassembly operations. Several types of tests are provided ... -
ECA CB-13
Abstract: PURPOSE
There are a number of techniques currently being used for measuring plating thickness. All have peculiar application and also limitations, Basic economics, however, demands that for measuring ... -
ECA EIA/ECA-364-105A
Abstract: This standard establishes a test method to simulate actual service usage by inducing low temperatures, and applying the test voltage at simulated altitudes. -
ECA 498AA00
Abstract: The (applicable modifiers to described subfamily of keyboards) keyboards of certified quality covered by this detail specification
A . have maximum enclosure dimensions of (maximum length, width, and height dimensions). ... -
ECA EIA-540DAAA-A
Abstract: The dual in-line sockets of assessed quality covered by this detail specification shall have:
a) Maximum enclosure dimensions (See Figure 1, 1 A, 2, and 3,).
b) Working voltage not to exceed 250 volts ír.m.s.1. ... -
ECA 454
Abstract: This Standard describes the requirements for paper and film-paper dielectric capacitors with other than poly chlorinated byphenyl (PCB) impregnants, hermetically sealed in metal cases for general purpose applications on ... -
ECA EIA-364-38C
Abstract: This standard establishes a test method to determine the axial tensile load that can be applied to a mated pair of connectors and the holding effect of a connector cable clamp without causing any detrimental effects upon ... -
ECA EIA/ECA-364-60A
Abstract: This test procedure details the methods for determining the porosity of contact finishes used in electrical connector, contacts and sockets.
Object
The object of this procedure is to determine the magnitude of ... -
ECA 540BAAB
Abstract: The Pin Grid Array Sockets of assessed quality covered by this detail specification have:
a) Maximum enclosure dimensions as shown i n Figure 1
b) A working voltage not exceeding 250 v o l t s (rms)
c) Maximum ... -
ECA 540AC00
Abstract: The Chip Carrier Sockets of assessed quality covered by this detail specification shall have:
a) Maximum enclosure of (maximum length, width and height dimensions).
b) A working voltage not exceeding _ volts (rms). ... -
ECA EIA-364-37C
Abstract: This standard establishes test methods which, when required by the referencing document, shall be used for measuring the engagement and separation forces on contacts.