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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 521-540 of 793
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IPC TM-650 2.3.14
Abstract: This test method provides a standard method for evaluating the effect of established processing operations used in the manufacture of PWBs on materials that are considered for use in the manufacture of PWBs. Specific ... -
IPC 2252
Abstract: This document addresses microwave circuitry. For the purpose of this document microwaves apply to radio waves in the frequency range of 100 MHz to 30 GHz. The document also applies to operations in the region where distributed ... -
IPC 1730A
Abstract: This Laminator Qualification Profile (LQP) isn't intended to satisfy all of the customer's requirements, however conscientious maintenance of this document and/or registration to ISO 9000 requirements should satisfy the ... -
IPC TM-650 2.5.5A
Abstract: The purpose of this test method is to provide a procedure to determine the dielectric constant at 1 MHz of laminate or substrate material. -
IPC HDBK-840
Abstract: Purpose
The purpose of this handbook is to provide additional supporting information for IPC-SM-840 regarding solder mask types, processes, characteristics and properties in order to assist with the ... -
IPC 1731
Abstract: This Strategic Raw Material Supplier Qualification Profile (SRMSQP) isn't intended to satisfy all of the customer's requirements, however conscientious maintenance of this document and/or registration to ISO 9000 requirements ... -
IPC 4556
Abstract: Statement of Scope
This specification sets the requirements for the use of Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) as a surface finish for printed boards. This specification ... -
IPC A-610F
Abstract: This standard is a collection of visual quality acceptability requirements for electronic assemblies. This standard does not provide criteria for cross-section evaluation.
This document presents acceptance requirements ... -
IPC TM-650 2.3.15D
Abstract: This is an electrogravimetric method for determining the purity of copper foil or plating. -
IPC TM-650 2.4.24.4
Abstract: This test is designed to determine the glass transition temperature (Tg) and room temperature storage modulus (E') of dielectric materials used in High Density Interconnect (HDI) and Microvias by the use of dynamic mechanical ... -
IPC TM-650 2.5.8A
Abstract: This test method provides a standard procedure to determine the dissipation factor of printed circuit materials. -
IPC 7351B GERMAN
Abstract: Dieses Dokument enthält Informationen über die Geome-trien der Anschlussflächen-Bilder (Land Pattern) für die Oberflächenmontage elektronischer Bauelemente. Ziel der gegebenen Informationen ist es, ... -
IPC DW-424
Abstract: This specification establishes the qualification and performance requirements for encapsulated discrete wire interconnection boards having wires which terminate in plated holes. -
IPC 7095C
Abstract: This document describes the design and assembly challenges for implementing Ball Grid Array (BGA) and Fine Pitch BGA (FBGA) technology. The effect of BGA and FBGA on current technology and component types is addressed, as ...