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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 501-520 of 793
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IPC TM-650 2.4.3.2C
Abstract: With this test method, the flexural fatigue life for any given bend radius, the flexural fatigue behavior, and the ductility of the metal cladding in percent deformation after tensile failure can be determined.
Note: ... -
IPC TM-650 2.5.33.4
Abstract: The following information is a supporting document in support of Method 2.5.33. The test methods within this group of procedures can be falsely influenced by radio frequency interference and electromagnetic interference ... -
IPC TM-650 2.4.4.1A
Abstract: This test method is designed to determine the flexural strength of laminates of the thicknesses greater than, or equal to, 0.51 mm [0.020 in] by applying a specific load to a specified sized and shaped specimen at elevated ... -
IPC TM-650 2.5.17.2
Abstract: This test method covers the two-wire resistance test for the determination of the volume resistivity of polymerbased conductive pastes and other conductive materials used in HDI. This test is valid for conductive materials ... -
IPC 4554 GERMAN
Abstract: Diese Spezifikation legt die Anforderungen an chemisch Zinn-Oberflächen als Endoberflächen von Leiterplatten fest. Sie ist für die Verwendung durch Lieferanten, Leiterplattenhersteller, Elektronik-Dienstleister ... -
IPC TM-650 2.4.14.2A
Abstract: This test method assesses the relative activity of liquid fluxes using a wetting balance. -
IPC A-600G JAPANESE
Abstract: This document describes the preferred, acceptable, and non-conforming conditions that are either externally or internally observable on printed boards. It represents the visual interpretation of minimum requirements set ... -
IPC TM-650 2.6.3.6
Abstract: This test method is used to characterize the effects of flux residues on electrical performance by determining the degradation of electrical insulation resistance under conditions of high temperature and humidity. This ... -
IPC 7912A
Abstract: This document is intended to define standard methods for the categorization of defects related to electronic printed board assemblies (PBAs). This document will provide consistent methodologies for calculating the following ... -
IPC 7711B/7721B ITALIAN
Abstract: This document covers procedures for repairing and reworking printed board assemblies. It is an aggregate of information collected, integrated and assembled by the Repairability Subcommittee (7-34) of the Product Assurance ... -
IPC TM-650 2.6.17
Abstract: This test method defines the procedure for determining the hydrolytic stability of a copper foil clad or unclad flexible dielectric material. -
IPC 4821
Abstract: This document describes materials that can be used for the fabrication of embedded passive capacitor devices within the finished printed circuit board substrate. For this document, embedded passive devices and the phrase ... -
IPC 4204A
Abstract: This standard establishes the classification system, the qualification and quality conformance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible printed circuitry and ... -
IPC IPC/JPCA-4591
Abstract: Statement of Scope This standard establishes the classification system, the qualification and quality conformance requirements for printed electronics functional conductive materials.
Purpose ...