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MIL-DTL-47113E
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
Organization:
DLA - GS3 - DLA Aviation - Richmond
Year: 2012
Abstract: This specification covers a silicone or non-silicone heat sink compound which is applied to the base and mounting studs of transistors and diodes to provide a positive heat sink seal
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| contributor author | DLA - GS3 - DLA Aviation - Richmond | |
| date accessioned | 2017-09-04T17:11:55Z | |
| date available | 2017-09-04T17:11:55Z | |
| date copyright | 05/15/2012 | |
| date issued | 2012 | |
| identifier other | YTRLVEAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std/handle/yse/135390 | |
| description abstract | This specification covers a silicone or non-silicone heat sink compound which is applied to the base and mounting studs of transistors and diodes to provide a positive heat sink seal | |
| language | English | |
| title | MIL-DTL-47113E | num |
| title | COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE | en |
| type | standard | |
| page | 11 | |
| status | Active | |
| tree | DLA - GS3 - DLA Aviation - Richmond:;2012 | |
| contenttype | fulltext |