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RISIPC TM-650 2.5.5.8: Low Frequency Dielectric Constant and Loss Tangent, Polymer Films
Abstract: This test method establishes a procedure for determining the low frequency out of plane dielectric constant and loss tangent of organic free films using a two-fluid method. (Low frequency is defined as less than or equal ...
IPC TM-650 2.2.12A: Thickness of Copper by Weight
Abstract: This method of test covers the procedure for determining weight (average thickness - by weight measurement) of copper foil for printed circuits.
IPC J-STD-006B CHINESE: English -- Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications - Incorporating Amendment 1: 1/2008 and Amendment 2: 10/2009
Abstract: This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for ...
IPC TM-650 2.4.24.5: Glass Transition Temperature and Thermal Expansion of Materials Used in High Density Interconnection (HDI) and Microvias - TMA Method
Abstract: This test is designed to determine the glass transition temperature (Tg) and coefficient of thermal expansion (CTE) of dielectric materials used in high density interconnect (HDI) and microvias by the use of thermal ...
IPC D-326A: Information Requirements for Manufacturing Printed Boards and Other Electronic Assemblies
Abstract: This document covers the information requirements for the procurement of material, box build, assembly, system integration, inspection, test, burn-in, and delivery and/or distribution of electronic assemblies.
IPC TM-650 2.3.38C: Surface Organic Contaminant Detection Test
Abstract: This test method is for use in determining if organic, nonionic contaminants are present on bare printed wiring board, and completed assembly surfaces in the production area by limited technical personnel. Although the ...
IPC TR-585: Time, Temperature and Humidity Stress of Final Board Finish Solderability
Abstract: PURPOSE
The purpose of this investigation is to identify a stress test that will distinguish between robust and non-robust finishes. A robust finish will pass a test for solderability, and a non robust ...
The purpose of this investigation is to identify a stress test that will distinguish between robust and non-robust finishes. A robust finish will pass a test for solderability, and a non robust ...
IPC TM-650 2.3.10.1: Flammability of Soldermask on Printed Wiring Laminate
Abstract: This test method is intended to evaluate the relative flame resistance characteristics of a permanent solder mask coating on specified printed wiring laminates. It is intended for use on laminate 0.5 mm thick and greater. ...
IPC TM-650 2.4.46A: Spread Test, Liquid, Paste or Solid Flux, or Flux Extracted from Solder Paste, Cored Wires or Preforms
Abstract: This test method will give an indication of activity of wave solder fluxes, core solder fluxes, and solder paste.
IPC TM-650 2.5.7D: Dielectric Withstanding Voltage, PCB
Abstract: The dielectric withstanding voltage test (also called high-potential, over potential, voltage breakdown, or dielectric strength test) consists of the application of a voltage higher than rated voltage for a specific time ...