درباره ما
IPC J-STD-006B CHINESE
English -- Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications - Incorporating Amendment 1: 1/2008 and Amendment 2: 10/2009;
Chinese -- 电子焊接领域 电子级焊料合金 及含有助焊剂 与不含助焊剂的 固体焊料的要求 - Incorporating Amendment 1: 1/2008 and Amendment 2: 10/2009
Organization:
IPC - Association Connecting Electronics Industries
Year: 2006
Abstract: This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for “special” electronic grade solders. This is a quality control standard and is not intended to relate directly to the material’s performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32.
This standard is one of a set of three joint industry standards the prescribe the requirements and test methods for soldering materials for use in the electronics industry:
IPC/EIA J-STD-004 Requirements for Soldering Fluxes
IPC/EIA J-STD-005 Requirements for Soldering Pastes
IPC J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications.Intended Use: This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.
This standard is one of a set of three joint industry standards the prescribe the requirements and test methods for soldering materials for use in the electronics industry:
IPC/EIA J-STD-004 Requirements for Soldering Fluxes
IPC/EIA J-STD-005 Requirements for Soldering Pastes
IPC J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications.Intended Use: This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.
Collections
:
-
Statistics
IPC J-STD-006B CHINESE
Show full item record
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:51:59Z | |
| date available | 2017-09-04T16:51:59Z | |
| date copyright | 01/01/2006 | |
| date issued | 2006 | |
| identifier other | WSCINEAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/115600 | |
| description abstract | This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for “special” electronic grade solders. This is a quality control standard and is not intended to relate directly to the material’s performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32. This standard is one of a set of three joint industry standards the prescribe the requirements and test methods for soldering materials for use in the electronics industry: IPC/EIA J-STD-004 Requirements for Soldering Fluxes IPC/EIA J-STD-005 Requirements for Soldering Pastes IPC J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications.Intended Use: This section contains information of a general or explanatory nature that may be helpful, but is not mandatory. | |
| language | Chinese | |
| title | IPC J-STD-006B CHINESE | num |
| title | English -- Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications - Incorporating Amendment 1: 1/2008 and Amendment 2: 10/2009 | en |
| title | Chinese -- 电子焊接领域 电子级焊料合金 及含有助焊剂 与不含助焊剂的 固体焊料的要求 - Incorporating Amendment 1: 1/2008 and Amendment 2: 10/2009 | other |
| type | standard | |
| page | 32 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2006 | |
| contenttype | fulltext |