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IPC TR-585
Time, Temperature and Humidity Stress of Final Board Finish Solderability
Organization:
IPC - Association Connecting Electronics Industries
Year: 2006
Abstract: PURPOSE
The purpose of this investigation is to identify a stress test that will distinguish between robust and non-robust finishes. A robust finish will pass a test for solderability, and a non robust finish will fail. The stress test need not duplicate real world environment (fabrication through assembly), but it must correlate to solderability performance.
The purpose of this investigation is to identify a stress test that will distinguish between robust and non-robust finishes. A robust finish will pass a test for solderability, and a non robust finish will fail. The stress test need not duplicate real world environment (fabrication through assembly), but it must correlate to solderability performance.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:47:47Z | |
| date available | 2017-09-04T16:47:47Z | |
| date copyright | 05/01/2006 | |
| date issued | 2006 | |
| identifier other | WGIIJBAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/111203 | |
| description abstract | PURPOSE The purpose of this investigation is to identify a stress test that will distinguish between robust and non-robust finishes. A robust finish will pass a test for solderability, and a non robust finish will fail. The stress test need not duplicate real world environment (fabrication through assembly), but it must correlate to solderability performance. | |
| language | English | |
| title | IPC TR-585 | num |
| title | Time, Temperature and Humidity Stress of Final Board Finish Solderability | en |
| type | standard | |
| page | 64 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2006 | |
| contenttype | fulltext |