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IPC TM-650 2.6.8.1
Thermal Stress, Laminate
Organization:
IPC - Association Connecting Electronics Industries
Year: 1991
Abstract: To determine the resistance of the laminate to thermal stress in both the etched and unetched state.
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IPC TM-650 2.6.8.1
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:47:17Z | |
| date available | 2017-09-04T16:47:17Z | |
| date copyright | 09/01/1991 | |
| date issued | 1991 | |
| identifier other | WESMCAAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/110594 | |
| description abstract | To determine the resistance of the laminate to thermal stress in both the etched and unetched state. | |
| language | English | |
| title | IPC TM-650 2.6.8.1 | num |
| title | Thermal Stress, Laminate | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1991 | |
| contenttype | fulltext |