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IPC TM-650 2.4.42.2
Die Shear Strength
Organization:
IPC - Association Connecting Electronics Industries
Year: 1998
Abstract: The purpose of this test is to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted elements to package headers or other substrates. This determination is based on a measure of force applied to the die, the type of failure resulting from this application of force (if failure occurs) and the visual appearance of the residual die attach media and substrate/header metallization.
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IPC TM-650 2.4.42.2
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:47:32Z | |
| date available | 2017-09-04T16:47:32Z | |
| date copyright | 02/01/1998 | |
| date issued | 1998 | |
| identifier other | WFQTCAAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/110954 | |
| description abstract | The purpose of this test is to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted elements to package headers or other substrates. This determination is based on a measure of force applied to the die, the type of failure resulting from this application of force (if failure occurs) and the visual appearance of the residual die attach media and substrate/header metallization. | |
| language | English | |
| title | IPC TM-650 2.4.42.2 | num |
| title | Die Shear Strength | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1998 | |
| contenttype | fulltext |