درباره ما
IPC TR-585
Time, Temperature and Humidity Stress of Final Board Finish Solderability
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:47:47Z | |
| date available | 2017-09-04T16:47:47Z | |
| date copyright | 05/01/2006 | |
| date issued | 2006 | |
| identifier other | WGIIJBAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/111203 | |
| description abstract | PURPOSE The purpose of this investigation is to identify a stress test that will distinguish between robust and non-robust finishes. A robust finish will pass a test for solderability, and a non robust finish will fail. The stress test need not duplicate real world environment (fabrication through assembly), but it must correlate to solderability performance. | |
| language | English | |
| title | IPC TR-585 | num |
| title | Time, Temperature and Humidity Stress of Final Board Finish Solderability | en |
| type | standard | |
| page | 64 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2006 | |
| contenttype | fulltext |
