Show simple item record

English -- Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications - Incorporating Amendment 1: 1/2008 and Amendment 2: 10/2009;
Chinese -- 电子焊接领域 电子级焊料合金 及含有助焊剂 与不含助焊剂的 固体焊料的要求 - Incorporating Amendment 1: 1/2008 and Amendment 2: 10/2009

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T16:51:59Z
date available2017-09-04T16:51:59Z
date copyright01/01/2006
date issued2006
identifier otherWSCINEAAAAAAAAAA.pdf
identifier urihttps://yse.yabesh.ir/std/handle/yse/115600
description abstractThis standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for “special” electronic grade solders. This is a quality control standard and is not intended to relate directly to the material’s performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32.
This standard is one of a set of three joint industry standards the prescribe the requirements and test methods for soldering materials for use in the electronics industry:
IPC/EIA J-STD-004 Requirements for Soldering Fluxes
IPC/EIA J-STD-005 Requirements for Soldering Pastes
IPC J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications.Intended Use: This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.
languageChinese
titleIPC J-STD-006B CHINESEnum
titleEnglish -- Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications - Incorporating Amendment 1: 1/2008 and Amendment 2: 10/2009en
titleChinese -- 电子焊接领域 电子级焊料合金 及含有助焊剂 与不含助焊剂的 固体焊料的要求 - Incorporating Amendment 1: 1/2008 and Amendment 2: 10/2009other
typestandard
page32
statusActive
treeIPC - Association Connecting Electronics Industries:;2006
contenttypefulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record