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IPC TM-650 2.4.26
Tape Test for Additive Printed Boards
Organization:
IPC - Association Connecting Electronics Industries
Year: 1979
Abstract: This test method shall establish and define the methods for predicting the bond strength, on a go-no-go basis, of additive rigid epoxy glass boards of the swelletchable type.
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IPC TM-650 2.4.26
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:01:01Z | |
| date available | 2017-09-04T17:01:01Z | |
| date copyright | 03/01/1979 | |
| date issued | 1979 | |
| identifier other | XQFICAAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/124505 | |
| description abstract | This test method shall establish and define the methods for predicting the bond strength, on a go-no-go basis, of additive rigid epoxy glass boards of the swelletchable type. | |
| language | English | |
| title | IPC TM-650 2.4.26 | num |
| title | Tape Test for Additive Printed Boards | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1979 | |
| contenttype | fulltext |