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DIN EN 62258-2
English -- Semiconductor die products - Part 2: Exchange data formats (IEC 62258-2:2011); English version EN 62258-2:2011;
German -- Halbleiter-Chip-Erzeugnisse - Teil 2: Datenaustausch-Formate (IEC 62258-2:2011); Englische Fassung EN 62258-2:2011
Organization:
DIN - Deutsches Institut für Normung e. V.
Year: 2011
Abstract: This Part of IEC 62258 specifies the data formats that may be used for the exchange of data which is covered by other parts of the IEC 62258 series, as well as definitions of all parameters used according to the principles and methods of IEC 61360. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between die manufacturer and CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, in accordance with ISO 10303-21, and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope.
It has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to:
• wafers,
• singulated bare die,
• die and wafers with attached connection structures,
• minimally or partially encapsulated die and wafers.
This standard reflects the DDX data format at version 1.3.0
It has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to:
• wafers,
• singulated bare die,
• die and wafers with attached connection structures,
• minimally or partially encapsulated die and wafers.
This standard reflects the DDX data format at version 1.3.0
Subject: Data exchange
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| contributor author | DIN - Deutsches Institut für Normung e. V. | |
| date accessioned | 2017-09-04T17:06:55Z | |
| date available | 2017-09-04T17:06:55Z | |
| date copyright | 2011.12.01 | |
| date issued | 2011 | |
| identifier other | YGJFQEAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/130458 | |
| description abstract | This Part of IEC 62258 specifies the data formats that may be used for the exchange of data which is covered by other parts of the IEC 62258 series, as well as definitions of all parameters used according to the principles and methods of IEC 61360. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between die manufacturer and CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, in accordance with ISO 10303-21, and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope. It has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to: • wafers, • singulated bare die, • die and wafers with attached connection structures, • minimally or partially encapsulated die and wafers. This standard reflects the DDX data format at version 1.3.0 | |
| language | English | |
| title | DIN EN 62258-2 | num |
| title | English -- Semiconductor die products - Part 2: Exchange data formats (IEC 62258-2:2011); English version EN 62258-2:2011 | en |
| title | German -- Halbleiter-Chip-Erzeugnisse - Teil 2: Datenaustausch-Formate (IEC 62258-2:2011); Englische Fassung EN 62258-2:2011 | other |
| type | standard | |
| page | 69 | |
| status | Active | |
| tree | DIN - Deutsches Institut für Normung e. V.:;2011 | |
| contenttype | fulltext | |
| subject keywords | Data exchange | |
| subject keywords | Data formats | |
| subject keywords | Datenaustausch | |
| subject keywords | Datenformat | |
| subject keywords | Electronic equipment and components | |
| subject keywords | elektronisches Bauelement | |
| subject keywords | Halbleiterbauelement | |
| subject keywords | Semiconductor devices |
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