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IEC 62258-6
Semiconductor die products – Part 6: Requirements for information concerning thermal simulation - First Edition
Organization:
IEC - International Electrotechnical Commission
Year: 2006
Abstract: This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including:
• wafers;
• singulated bare die;
• die and wafers with attached connection structures;
• minimally or partially encapsulated die and wafers.
This part of IEC 62258 determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2.
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• wafers;
• singulated bare die;
• die and wafers with attached connection structures;
• minimally or partially encapsulated die and wafers.
This part of IEC 62258 determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2.
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| contributor author | IEC - International Electrotechnical Commission | |
| date accessioned | 2017-09-04T15:37:56Z | |
| date available | 2017-09-04T15:37:56Z | |
| date copyright | 2006.08.01 | |
| date issued | 2006 | |
| identifier other | OWOPJBAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/39923 | |
| description abstract | This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including: • wafers; • singulated bare die; • die and wafers with attached connection structures; • minimally or partially encapsulated die and wafers. This part of IEC 62258 determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2.  | |
| language | English | |
| title | IEC 62258-6 | num |
| title | Semiconductor die products – Part 6: Requirements for information concerning thermal simulation - First Edition | en |
| type | standard | |
| page | 16 | |
| status | Active | |
| tree | IEC - International Electrotechnical Commission:;2006 | |
| contenttype | fulltext |