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IPC TM-650 2.3.1
Chemical Processing, Suitable Processing Material
Organization:
IPC - Association Connecting Electronics Industries
Year: 1973
Abstract: This test method covers acceptance of incoming copper clad epoxy-glass laminates ranging in thickness from 0.8 mm to 6.5 mm, clad on one or both sides. It provides for a standard method of inspection and establishes operations that simulate the manufacture of PWBs. Specific values for the acceptability are based on copper foil adhesion and visual surface condition of the base laminate.
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IPC TM-650 2.3.1
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:13:23Z | |
| date available | 2017-09-04T17:13:23Z | |
| date copyright | 04/01/1973 | |
| date issued | 1973 | |
| identifier other | CASTCAAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/136868 | |
| description abstract | This test method covers acceptance of incoming copper clad epoxy-glass laminates ranging in thickness from 0.8 mm to 6.5 mm, clad on one or both sides. It provides for a standard method of inspection and establishes operations that simulate the manufacture of PWBs. Specific values for the acceptability are based on copper foil adhesion and visual surface condition of the base laminate. | |
| language | English | |
| title | IPC TM-650 2.3.1 | num |
| title | Chemical Processing, Suitable Processing Material | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1973 | |
| contenttype | fulltext |