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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 1-20 of 793
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IPC D-640
Abstract: Scope: This document provides design and critical process requirements and technical insight for cable and wire harness assemblies incorporating optical fiber, optical cable and hybrid wiring technology. Reference materials ... -
IPC 1071B
Abstract: Scope: Purpose The purpose of this standard is to assist printed board (PB) manufacturers in the development of requirements for the protection of intellectual property (IP) for their customers in commercial, industrial ... -
IPC 9121
Abstract: Scope: GENERAL INTRODUCTION This handbook provides problems, causes and possible corrective actions related to PWB manufacturing processes. To keep this document current, readers are encouraged to submit process problems ... -
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IPC 9204
Abstract: Scope: This guideline describes flexibility and stretchability tests that may be used to evaluate printed electronics for flexible, stretchable and wearable applications. Purpose This guideline describes tests which the ... -
IPC 6018C
Abstract: Scope: Statement of Scope This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or ... -
IPC 2223D
Abstract: Scope: This standard establishes the specific requirements for the design of flexible and rigid-flexible printed board applications and its forms of component mounting and interconnecting structures. The flexible materials ... -
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IPC 7711C/7721C
Abstract: Scope: This document covers procedures for repairing and reworking printed board assemblies. It is an aggregate of information collected, integrated and assembled by the Repairability Subcommittee (7-34) of the Product ... -
IPC 7530A
Abstract: Scope: This standard describes thermal profile guidelines and practical guidelines to meet requirements to produce acceptable solder joints in mass soldering processes, including but not limited to reflow and wave soldering. ... -
IPC IPC/ECIA/JEDEC J-STD-046
Abstract: Scope: This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes ... -
IPC IPC/JEDEC J-STD-609B
Abstract: Scope: This standard applies to components and assemblies that contain Pb-free and Pb-containing solders and finishes. This standard describes the marking of components and the labeling of their shipping containers to ... -
IPC IPC/WHMA-A-620C
Abstract: Scope: This standard prescribes practices and requirements for the manufacture of cable, wire and harness assemblies. This standard does not provide criteria for cross-section or X-ray evaluation. Purpose This standard ... -
IPC 9252B
Abstract: Scope: This document is intended to assist in selecting the test analyzer, test parameters, test data, and fixturing required to perform electrical test(s) on all unpopulated printed boards. The testing of printed boards ... -
IPC 9691B
Abstract: Scope: This document is the product of the IPC Electrochemical Migration (ECM) Task Group. It was drafted to provide guidance regarding implementation of the User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic ... -
IPC 4202B
Abstract: Scope: This standard establishes the classification system, the qualification and quality conformance requirements for flexible base dielectric materials to be used for the fabrication of flexible printed boards. This ... -
IPC 1601A
Abstract: Scope: This document provides suggestions for proper handling, packaging materials and methods, environmental conditions, and storage for printed boards. These guidelines are intended to protect printed boards from ... -
IPC 9241
Abstract: Scope: Microsection preparation is a process. These guidelines discuss the many variables and problems associated with the process from sample removal to micro-etch. The guidelines do not promote any one vendor’s ... -
IPC 4101E
Abstract: Scope: This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic circuits. -
IPC 1782
Abstract: Scope: This standard establishes minimum requirements for manufacturing and supply chain traceability based on perceived risk as agreed between user and supplier (AABUS). This standard applies to all products, processes, ...