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IPC 9691B
English -- User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
Organization:
IPC - Association Connecting Electronics Industries
Year: 2016
Abstract: Scope: This document is the product of the IPC Electrochemical Migration (ECM) Task Group. It was drafted to provide guidance regarding implementation of the User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing to evaluate the effects of mechanical stress, laminate material fracturing, ionic contamination, moisture content prior to press lamination, and other material processing characteristics on formation of conductive paths within laminate material such as conductive anodic filaments (CAF), one specific type of ECM failure mode. This internal ECM test method provides a proven standard for determining the risk of through-hole bias and other internal conductor orientations that result in significant reduction of insulation resistance internally, rather than on the surface of printed boards. PURPOSE This user guide addresses test issues regarding determining pass/fail criteria based on knowledge of three product goals: a) What are the long term reliability requirements? b) What is the closest spacing required for a given voltage? c) Evaluate the internal ECM Failure risk.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-10-18T11:03:33Z | |
| date available | 2017-10-18T11:03:33Z | |
| date copyright | 2016.06.01 | |
| date issued | 2016 | |
| identifier other | PSVASFAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/234359 | |
| description abstract | Scope: This document is the product of the IPC Electrochemical Migration (ECM) Task Group. It was drafted to provide guidance regarding implementation of the User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing to evaluate the effects of mechanical stress, laminate material fracturing, ionic contamination, moisture content prior to press lamination, and other material processing characteristics on formation of conductive paths within laminate material such as conductive anodic filaments (CAF), one specific type of ECM failure mode. This internal ECM test method provides a proven standard for determining the risk of through-hole bias and other internal conductor orientations that result in significant reduction of insulation resistance internally, rather than on the surface of printed boards. PURPOSE This user guide addresses test issues regarding determining pass/fail criteria based on knowledge of three product goals: a) What are the long term reliability requirements? b) What is the closest spacing required for a given voltage? c) Evaluate the internal ECM Failure risk. | |
| language | English | |
| title | IPC 9691B | num |
| title | English -- User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing | en |
| type | standard | |
| page | 48 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2016 | |
| contenttype | fulltext |