JEDEC JESD22-B117A

Solder Ball Shea

contributor author	JEDEC - Solid State Technology Association
date accessioned	2017-09-04T17:56:53Z
date available	2017-09-04T17:56:53Z
date copyright	38991
date issued	2006
identifier other	FNJSJBAAAAAAAAAA.pdf
identifier uri	https://yse.yabesh.ir/std/handle/yse/179991
description abstract	The purpose of this test is conducted to assess the ability of solder balls to withstand mechanical shear forces that may be applied during device manufacturing, handling, test, shipment and end-use conditions. Solder ball shear is a destructive test.
language	English
title	JEDEC JESD22-B117A	num
title	Solder Ball Shea	en
type	standard
page	16
status	Active
tree	JEDEC - Solid State Technology Association:;2006
contenttype	fulltext
subject keywords	Failure Mode - Ball Shear
subject keywords	Shear
subject keywords	Solder
subject keywords	Test Method - Solder Ball Shear