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SMD-5962-95651 REV C

MICROCIRCUIT, DIGITAL, RADIATION HARDENED ADVANCED CMOS, QUAD 2-INPUT AND GATE, MONOLITHIC SILICON

Organization:
DLA - CC - DLA Land and Maritime
Year: 2000

Abstract: This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN is as shown in the following example: CHART
Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) identify the circuit function as follows:
        Device type        Generic number                 Circuit function               01               ACS08            Radiation hardened SOS, advanced CMOS,                                                quad 2-input AND gate               02               ACS08-02 1/      Radiation hardened SOS, advanced CMOS,                                                quad 2-input AND gate


The device class designator is a single letter identifying the product assurance level as follows:
      Device class                     Device requirements documentation            M             Vendor self-certification to the requirements for MIL-STD-883 compliant,                         non-JAN class level B microcircuits in accordance with MIL-PRF-38535,                         appendix A          Q or V          Certification and qualification to MIL-PRF-38535


The case outline(s) are as designated in MIL-STD-1835 and as follows:
      Outline letter    Descriptive designator   Terminals           Package style              C                    CDIP2-T14          14        dual-in-line package             X                    CDFP3-F14          14        flat package


The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.
 Supply voltage range (VCC)............................................ −0.5 V dc to +7.0 V dc  DC input voltage range (VIN).......................................... −0.5 V dc to VCC + 0.5 V dc  DC output voltage range (VOUT)........................................ −0.5 V dc to VCC + 0.5 V dc  DC input current, any one input (IIN)................................. ±10 mA  DC output current, any one output (IOUT).............................. ±50 mA  Storage temperature range (TSTG)...................................... −65°C to +150°C  Lead temperature (soldering, 10 seconds).............................. +265°C  Thermal resistance, junction-to-case (θJC):   Case outline C....................................................... 24°C/W   Case outline X....................................................... 30°C/W  Thermal resistance, junction-to-ambient (θJA):   Case outline C....................................................... 74°C/W   Case outline X....................................................... 116°C/w  Junction temperature (TJ)............................................. +175°C  Maximum package power dissipation at TA = +125°C (PD): 4/   Case outline C....................................................... 0.68 W   Case outline X....................................................... 0.43 W


 Supply voltage range (VCC)............................................ +4.5 V dc to +5.5 V dc  Input voltage range (VIN)............................................. +0.0 V dc to VCC  Output voltage range (VOUT)........................................... +0.0 V dc to VCC  Maximum low level input voltage (VIL)................................. 30% of VCC  Minimum high level input voltage (VIH)................................ 70% of VCC  Case operating temperature range (TC)................................. −55°C to +125°C  Maximum input rise and fall time at VCC = 4.5 V (tr, tf).............. 10 ns/V  Radiation features:   Total dose........................................................... > 3 × 105 Rads (Si)   Single event phenomenon (SEP) effective    linear energy threshold (LET) no upsets (see 4.4.4.4)............... > 100 MeV/(cm2/mg) 5/   Dose rate upset (20 ns pulse)........................................ > 1 × 1011 Rads (Si)/s 5/   Latch-up............................................................. None 5/   Dose rate survivability.............................................. > 1 × 1012 Rads (Si)/s 5/


Intended Use: Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. Microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared specification or drawing. Device class Q devices will replace device class M devices.
URI: https://yse.yabesh.ir/std/handle/yse/206386
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    SMD-5962-95651 REV C

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contributor authorDLA - CC - DLA Land and Maritime
date accessioned2017-09-04T18:23:58Z
date available2017-09-04T18:23:58Z
date copyright07/17/2000
date issued2000
identifier otherIFMUMAAAAAAAAAAA.pdf
identifier urihttps://yse.yabesh.ir/std/handle/yse/206386
description abstractThis drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN is as shown in the following example: CHART
Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) identify the circuit function as follows:
        Device type        Generic number                 Circuit function               01               ACS08            Radiation hardened SOS, advanced CMOS,                                                quad 2-input AND gate               02               ACS08-02 1/      Radiation hardened SOS, advanced CMOS,                                                quad 2-input AND gate


The device class designator is a single letter identifying the product assurance level as follows:
      Device class                     Device requirements documentation            M             Vendor self-certification to the requirements for MIL-STD-883 compliant,                         non-JAN class level B microcircuits in accordance with MIL-PRF-38535,                         appendix A          Q or V          Certification and qualification to MIL-PRF-38535


The case outline(s) are as designated in MIL-STD-1835 and as follows:
      Outline letter    Descriptive designator   Terminals           Package style              C                    CDIP2-T14          14        dual-in-line package             X                    CDFP3-F14          14        flat package


The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.
 Supply voltage range (VCC)............................................ −0.5 V dc to +7.0 V dc  DC input voltage range (VIN).......................................... −0.5 V dc to VCC + 0.5 V dc  DC output voltage range (VOUT)........................................ −0.5 V dc to VCC + 0.5 V dc  DC input current, any one input (IIN)................................. ±10 mA  DC output current, any one output (IOUT).............................. ±50 mA  Storage temperature range (TSTG)...................................... −65°C to +150°C  Lead temperature (soldering, 10 seconds).............................. +265°C  Thermal resistance, junction-to-case (θJC):   Case outline C....................................................... 24°C/W   Case outline X....................................................... 30°C/W  Thermal resistance, junction-to-ambient (θJA):   Case outline C....................................................... 74°C/W   Case outline X....................................................... 116°C/w  Junction temperature (TJ)............................................. +175°C  Maximum package power dissipation at TA = +125°C (PD): 4/   Case outline C....................................................... 0.68 W   Case outline X....................................................... 0.43 W


 Supply voltage range (VCC)............................................ +4.5 V dc to +5.5 V dc  Input voltage range (VIN)............................................. +0.0 V dc to VCC  Output voltage range (VOUT)........................................... +0.0 V dc to VCC  Maximum low level input voltage (VIL)................................. 30% of VCC  Minimum high level input voltage (VIH)................................ 70% of VCC  Case operating temperature range (TC)................................. −55°C to +125°C  Maximum input rise and fall time at VCC = 4.5 V (tr, tf).............. 10 ns/V  Radiation features:   Total dose........................................................... > 3 × 105 Rads (Si)   Single event phenomenon (SEP) effective    linear energy threshold (LET) no upsets (see 4.4.4.4)............... > 100 MeV/(cm2/mg) 5/   Dose rate upset (20 ns pulse)........................................ > 1 × 1011 Rads (Si)/s 5/   Latch-up............................................................. None 5/   Dose rate survivability.............................................. > 1 × 1012 Rads (Si)/s 5/


Intended Use: Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. Microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared specification or drawing. Device class Q devices will replace device class M devices.
languageEnglish
titleSMD-5962-95651 REV Cnum
titleMICROCIRCUIT, DIGITAL, RADIATION HARDENED ADVANCED CMOS, QUAD 2-INPUT AND GATE, MONOLITHIC SILICONen
typestandard
page22
statusActive
treeDLA - CC - DLA Land and Maritime:;2000
contenttypefulltext
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