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ECA EIA-800
Integrated Passive Device (IPD) Chipscale Package Design Guidelines
Organization:
ECIA - Electronic Components Industry Association
Year: 1999
Abstract: Introduction
This guideline is intended to facilitate a common industry direction with regard to IPD chipscale packaging. This guideline is not intended to document special product designs that are supplier–customer unique.
This guideline is intended to facilitate a common industry direction with regard to IPD chipscale packaging. This guideline is not intended to document special product designs that are supplier–customer unique.
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| contributor author | ECIA - Electronic Components Industry Association | |
| date accessioned | 2017-09-04T18:27:21Z | |
| date available | 2017-09-04T18:27:21Z | |
| date copyright | 03/01/1999 | |
| date issued | 1999 | |
| identifier other | AIDMPAAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/209473 | |
| description abstract | Introduction This guideline is intended to facilitate a common industry direction with regard to IPD chipscale packaging. This guideline is not intended to document special product designs that are supplier–customer unique. | |
| language | English | |
| title | ECA EIA-800 | num |
| title | Integrated Passive Device (IPD) Chipscale Package Design Guidelines | en |
| type | standard | |
| page | 11 | |
| status | Active | |
| tree | ECIA - Electronic Components Industry Association:;1999 | |
| contenttype | fulltext |