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ECA 700AAAB

Detail Specification for 1.0 mm, Two-Part Connectors for Use with Parallel Printed Boards

Organization:
ECIA - Electronic Components Industry Association
Year: 1996

Abstract: This standard is applicable to high density, modular two-part connectors, designed for use with printed mezzanine cards that are intended to be installed parallel to host printed boards. The resultant stack height between the mezzanine card and the host boards can vary, depending upon the plug and receptacle combination selected. One or more connectors bmea iyn stalled on a mezzanine card ohr ost board. Connectors may be positioned end-to-end and/or side-to-side on the boards to make up arrays of connectors to satisfy the needs of different applications.
Object
The object of this detail specificationi s to provide all the information necessartyo implement the connectors described herein. Typical applications are showinn t he following IEEE Standards:
P1386: Standard for a Common Mezzanine Card (CMC) Family
P1386.1: Standard for PC1 Mezzanine Cards (PMC)
P1386.2: Standard for SBUS Mezzanine Cards (SMC)
All of the above are based on the IEEE P1301.4 and the other related IEEE Hard Metric Mechanical Standards. This standard also provides all the information required for the identification, qualification testing, and quality assessment of the 1.0 mm Mezzanine Connectors in accord with the EIA-NECQ Quality System. The information contained herein, or by reference, may ablso be used for inspection purposes.
This standard is intended to be used in conjunction with Generic Specification EIA-7000000, Sectional Specification, Printed Board Connectors, EIA-700A000, and EIA-364, Test Procedures, including Environmental Classifications, and Bellcore Technical Reference TR-NWT-001217.
Two Performance Levels are specified herein (PL1 and PL2) ; PL1 is intended for usein computer equipment, and uses EIA-364 guidelines.
PL2 is intended for telecommunication equipment applications, and uses the guidelines given in Bellcore TR-NWT-001217, except that the initial low level contact resistance maximum must not exceed 30 milliohms, and the test voltage for the DWV test shale be 250 V.
URI: https://yse.yabesh.ir/std/handle/yse/209773
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    ECA 700AAAB

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contributor authorECIA - Electronic Components Industry Association
date accessioned2017-09-04T18:27:36Z
date available2017-09-04T18:27:36Z
date copyright01/01/1996
date issued1996
identifier otherIOJSCAAAAAAAAAAA.pdf
identifier urihttps://yse.yabesh.ir/std/handle/yse/209773
description abstractThis standard is applicable to high density, modular two-part connectors, designed for use with printed mezzanine cards that are intended to be installed parallel to host printed boards. The resultant stack height between the mezzanine card and the host boards can vary, depending upon the plug and receptacle combination selected. One or more connectors bmea iyn stalled on a mezzanine card ohr ost board. Connectors may be positioned end-to-end and/or side-to-side on the boards to make up arrays of connectors to satisfy the needs of different applications.
Object
The object of this detail specificationi s to provide all the information necessartyo implement the connectors described herein. Typical applications are showinn t he following IEEE Standards:
P1386: Standard for a Common Mezzanine Card (CMC) Family
P1386.1: Standard for PC1 Mezzanine Cards (PMC)
P1386.2: Standard for SBUS Mezzanine Cards (SMC)
All of the above are based on the IEEE P1301.4 and the other related IEEE Hard Metric Mechanical Standards. This standard also provides all the information required for the identification, qualification testing, and quality assessment of the 1.0 mm Mezzanine Connectors in accord with the EIA-NECQ Quality System. The information contained herein, or by reference, may ablso be used for inspection purposes.
This standard is intended to be used in conjunction with Generic Specification EIA-7000000, Sectional Specification, Printed Board Connectors, EIA-700A000, and EIA-364, Test Procedures, including Environmental Classifications, and Bellcore Technical Reference TR-NWT-001217.
Two Performance Levels are specified herein (PL1 and PL2) ; PL1 is intended for usein computer equipment, and uses EIA-364 guidelines.
PL2 is intended for telecommunication equipment applications, and uses the guidelines given in Bellcore TR-NWT-001217, except that the initial low level contact resistance maximum must not exceed 30 milliohms, and the test voltage for the DWV test shale be 250 V.
languageEnglish
titleECA 700AAABnum
titleDetail Specification for 1.0 mm, Two-Part Connectors for Use with Parallel Printed Boardsen
typestandard
page44
statusActive
treeECIA - Electronic Components Industry Association:;1996
contenttypefulltext
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