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Guideline for Developing and Documenting Package Electrical Models Derived from Computational Analysis

contributor authorJEDEC - Solid State Technology Association
date accessioned2017-09-04T18:36:46Z
date available2017-09-04T18:36:46Z
date copyright05/01/1996
date issued1996
identifier otherJMAQCAAAAAAAAAAA.pdf
identifier urihttps://yse.yabesh.ir/std/handle/yse/218765
description abstractThis publication provides a guideline to suppliers of IC components with a template for documenting the numerical simulation assumptions. In addition this guideline also suggests a model environment to reference when comparing various packages or component suppliers. This publication should improve the communication between the package model suppliers. This publication should improve the communication between the package model supplier and the end user. 
languageEnglish
titleJEDEC JEP126num
titleGuideline for Developing and Documenting Package Electrical Models Derived from Computational Analysisen
typestandard
page9
statusActive
treeJEDEC - Solid State Technology Association:;1996
contenttypefulltext


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