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ECA 213
Test Point Locations for Printed Wiring Assemblies
Organization:
ECIA - Electronic Components Industry Association
Year: 1983
Abstract: All test points shall be compatible in ali respects with the latest issue of EIA Standard RS-188, Standard Dimensional System for Automation Requirements.
All test points shall be brought out to any three edges of the printed wiring board whenever possible.
There are two preferred test-point location systems, A and B. A third system, C, can be used when it is impractical to bring the test points to the edge of the board.
All test points shall be brought out to any three edges of the printed wiring board whenever possible.
There are two preferred test-point location systems, A and B. A third system, C, can be used when it is impractical to bring the test points to the edge of the board.
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| contributor author | ECIA - Electronic Components Industry Association | |
| date accessioned | 2017-09-04T18:43:04Z | |
| date available | 2017-09-04T18:43:04Z | |
| date copyright | 01/01/1958 (R 1983) | |
| date issued | 1983 | |
| identifier other | KAXWCAAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/224479 | |
| description abstract | All test points shall be compatible in ali respects with the latest issue of EIA Standard RS-188, Standard Dimensional System for Automation Requirements. All test points shall be brought out to any three edges of the printed wiring board whenever possible. There are two preferred test-point location systems, A and B. A third system, C, can be used when it is impractical to bring the test points to the edge of the board. | |
| language | English | |
| title | ECA 213 | num |
| title | Test Point Locations for Printed Wiring Assemblies | en |
| type | standard | |
| page | 4 | |
| status | Active | |
| tree | ECIA - Electronic Components Industry Association:;1983 | |
| contenttype | fulltext |