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ECA EIA-540F000
Sectional Specification for Multi-Package Module Sockets for Use in Electronic Equipment
Organization:
ECIA - Electronic Components Industry Association
Year: 1997
Abstract: This Sectional Specification relates to the sockets for Multi-Package Modules of assessed qualtty. The purpose of this Specification is to provide a means of assuring interchange-ability between devices and compatibilrty between the board and the socket for the multipackage module socket and to provide standardized test methods, gauges and performance requirements.
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ECA EIA-540F000
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| contributor author | ECIA - Electronic Components Industry Association | |
| date accessioned | 2017-09-04T18:49:40Z | |
| date available | 2017-09-04T18:49:40Z | |
| date copyright | 11/01/1991 (R 1997) | |
| date issued | 1997 | |
| identifier other | KSLUCAAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/231029 | |
| description abstract | This Sectional Specification relates to the sockets for Multi-Package Modules of assessed qualtty. The purpose of this Specification is to provide a means of assuring interchange-ability between devices and compatibilrty between the board and the socket for the multipackage module socket and to provide standardized test methods, gauges and performance requirements. | |
| language | English | |
| title | ECA EIA-540F000 | num |
| title | Sectional Specification for Multi-Package Module Sockets for Use in Electronic Equipment | en |
| type | standard | |
| page | 16 | |
| status | Active | |
| tree | ECIA - Electronic Components Industry Association:;1997 | |
| contenttype | fulltext |