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IPC TR-470
Thermal Characteristics of Multilayer Interconnection Boards
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:23:01Z | |
| date available | 2017-09-04T15:23:01Z | |
| date copyright | 01/01/1974 | |
| date issued | 1974 | |
| identifier other | NDZZCAAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/23217 | |
| language | English | |
| title | IPC TR-470 | num |
| title | Thermal Characteristics of Multilayer Interconnection Boards | en |
| type | standard | |
| page | 26 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1974 | |
| contenttype | fulltext |
