IPC TR-470
Thermal Characteristics of Multilayer Interconnection Boards
Organization:
IPC - Association Connecting Electronics Industries
Year: 1974
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contributor author | IPC - Association Connecting Electronics Industries | |
date accessioned | 2017-09-04T15:23:01Z | |
date available | 2017-09-04T15:23:01Z | |
date copyright | 01/01/1974 | |
date issued | 1974 | |
identifier other | NDZZCAAAAAAAAAAA.pdf | |
identifier uri | https://yse.yabesh.ir/std/handle/yse/23217 | |
language | English | |
title | IPC TR-470 | num |
title | Thermal Characteristics of Multilayer Interconnection Boards | en |
type | standard | |
page | 26 | |
status | Active | |
tree | IPC - Association Connecting Electronics Industries:;1974 | |
contenttype | fulltext |